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Mutual coupling reduction using grounded copper vertical plane structure

2018-10-08Conference object Restricted access
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dc.contributor.authorBouça, Patricia
dc.contributor.authorCarvalho, Nuno Borges de
dc.contributor.authorPinho, Pedro
dc.date.accessioned2018-10-16T09:16:10Z
dc.date.available2018-10-16T09:16:10Z
dc.date.issued2018-10-08
dc.description.abstractNowadays, a common concern in 5G communications is the large amount of antennas per array, this is important in mMIMO solutions. This imply a reduction of space between elements, and thus a significant increase in coupling.This paper presents a new solution to reduce mutual coupling in an antenna array. A parametric study was made to determine the influence of mutual coupling depending on the distance between each element. A decoupling structure is proposed which consists on a grounded vertical copper plane between every patch. To achieve a better isolation, these new elements introduce an extra coupling. The experimental results indicate that using a Copper Vertical Plane Structure the Coupling can be reduced in 3dB.pt_PT
dc.description.versioninfo:eu-repo/semantics/publishedVersionpt_PT
dc.identifier.citationBOUÇA, Patrícia; CARVALHO, Nuno Borges de; PINHO, Pedro – Mutual coupling reduction using grounded copper vertical plane structure. In 2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G). Dublin, Ireland: IEEE, 2018. ISBN 978-1-5386-1198-2. Pp. 1-3pt_PT
dc.identifier.doi10.1109/IMWS-5G.2018.8484705pt_PT
dc.identifier.isbn978-1-5386-1198-2
dc.identifier.isbn978-1-5386-1197-5
dc.identifier.isbn978-1-5386-1196-8
dc.identifier.urihttp://hdl.handle.net/10400.21/8923
dc.language.isoengpt_PT
dc.peerreviewedyespt_PT
dc.publisherInstitute of Electrical and Electronics Engineerspt_PT
dc.relationPOCI-01-0247-FEDER-024539pt_PT
dc.relation.publisherversionhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8484705pt_PT
dc.subjectMutual Couplingpt_PT
dc.subjectDecoupling structurept_PT
dc.titleMutual coupling reduction using grounded copper vertical plane structurept_PT
dc.typeconference object
dspace.entity.typePublication
oaire.citation.conferencePlace30-31 Aug. 2018 - Dublin, Irelandpt_PT
oaire.citation.endPage3pt_PT
oaire.citation.startPage1pt_PT
oaire.citation.title2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G)pt_PT
person.familyNameBouça
person.familyNamePinho
person.givenNamePatricia
person.givenNamePedro
person.identifier.ciencia-id5E11-ADF3-3AF2
person.identifier.ciencia-id4C17-7EC8-C889
person.identifier.orcid0000-0002-7800-6897
person.identifier.orcid0000-0001-5588-7794
person.identifier.ridD-4304-2009
person.identifier.scopus-author-id16031596400
rcaap.rightsclosedAccesspt_PT
rcaap.typeconferenceObjectpt_PT
relation.isAuthorOfPublication32192597-18a2-4cc6-af87-dddf149a44f1
relation.isAuthorOfPublication8347c340-8bc5-4fe8-8377-6bf016c2e2d2
relation.isAuthorOfPublication.latestForDiscovery8347c340-8bc5-4fe8-8377-6bf016c2e2d2

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