Repository logo
 
No Thumbnail Available
Publication

Mutual coupling reduction using grounded copper vertical plane structure

Use this identifier to reference this record.
Name:Description:Size:Format: 
Mutual_PPinho_ADEETC.pdf2.13 MBAdobe PDF Download

Advisor(s)

Abstract(s)

Nowadays, a common concern in 5G communications is the large amount of antennas per array, this is important in mMIMO solutions. This imply a reduction of space between elements, and thus a significant increase in coupling.This paper presents a new solution to reduce mutual coupling in an antenna array. A parametric study was made to determine the influence of mutual coupling depending on the distance between each element. A decoupling structure is proposed which consists on a grounded vertical copper plane between every patch. To achieve a better isolation, these new elements introduce an extra coupling. The experimental results indicate that using a Copper Vertical Plane Structure the Coupling can be reduced in 3dB.

Description

Keywords

Mutual Coupling Decoupling structure

Citation

BOUÇA, Patrícia; CARVALHO, Nuno Borges de; PINHO, Pedro – Mutual coupling reduction using grounded copper vertical plane structure. In 2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G). Dublin, Ireland: IEEE, 2018. ISBN 978-1-5386-1198-2. Pp. 1-3

Research Projects

Organizational Units

Journal Issue

Publisher

Institute of Electrical and Electronics Engineers

CC License

Altmetrics