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Electrodeposition and characterization of nikel-copper metallic foams for application as electrodes for supercapacitors

dc.contributor.authorEugénio, S.
dc.contributor.authorSilva, Maria Teresa Oliveira de Moura e
dc.contributor.authorCarmezim, M. J.
dc.contributor.authorDuarte, R. G.
dc.contributor.authorMontemor, M. F.
dc.date.accessioned2015-08-21T11:42:32Z
dc.date.available2015-08-21T11:42:32Z
dc.date.issued2014-04
dc.description.abstractNickel-copper metallic foams were electrodeposited from an acidic electrolyte, using hydrogen bubble evolution as a dynamic template. Their morphology and chemical composition was studied by scanning electron microscopy and related to the deposition parameters (applied current density and deposition time). For high currents densities (above 1 A cm(-2)) the nickel-copper deposits have a three-dimensional foam-like morphology with randomly distributed nearly-circular pores whose walls present an open dendritic structure. The nickel-copper foams are crystalline and composed of pure nickel and a copper-rich phase containing nickel in solid solution. The electrochemical behaviour of the material was studied by cyclic voltammetry and chronopotentiometry (charge-discharge curves) aiming at its application as a positive electrode for supercapacitors. Cyclic voltammograms showed that the Ni-Cu foams have a pseudocapacitive behaviour. The specific capacitance was calculated from charge-discharge data and the best value (105 F g(-1) at 1 mA cm(-2)) was obtained for nickel-copper foams deposited at 1.8 A cm(-2) for 180 s. Cycling stability of these foams was also assessed and they present a 90 % capacitance retention after 10,000 cycles at 10 mA cm(-2).por
dc.identifier.citationEUGÉNIO, S.; [et al] – Electrodeposition and characterization of nikel-copper metallic foams for application as electrodes for supercapacitors. Journal of Applied Electrochemistry. ISSN: 0021-891X. Vol. 44, nr. 4 (2014), pp. 455-465por
dc.identifier.doi10.1007/s10800-013-0646-y
dc.identifier.issn0021-891X
dc.identifier.issn1572-8838
dc.identifier.urihttp://hdl.handle.net/10400.21/4904
dc.language.isoengpor
dc.peerreviewedyespor
dc.publisherSpringer Netherlandspor
dc.subjectNickel-Copperpor
dc.subjectNanostructured Foamspor
dc.subjectElectrodepositionpor
dc.subjectElectrodes for Supercapacitorspor
dc.titleElectrodeposition and characterization of nikel-copper metallic foams for application as electrodes for supercapacitorspor
dc.typejournal article
dspace.entity.typePublication
oaire.citation.conferencePlaceDordrechtpor
oaire.citation.endPage465por
oaire.citation.issue4por
oaire.citation.startPage455por
oaire.citation.titleJournal of Applied Electrochemistrypor
oaire.citation.volume44por
rcaap.rightsclosedAccesspor
rcaap.typearticlepor

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