Bouça, PatriciaCarvalho, Nuno Borges dePinho, Pedro2018-10-162018-10-162018-10-08BOUÇA, Patrícia; CARVALHO, Nuno Borges de; PINHO, Pedro – Mutual coupling reduction using grounded copper vertical plane structure. In 2018 IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies (IMWS-5G). Dublin, Ireland: IEEE, 2018. ISBN 978-1-5386-1198-2. Pp. 1-3978-1-5386-1198-2978-1-5386-1197-5978-1-5386-1196-8http://hdl.handle.net/10400.21/8923Nowadays, a common concern in 5G communications is the large amount of antennas per array, this is important in mMIMO solutions. This imply a reduction of space between elements, and thus a significant increase in coupling.This paper presents a new solution to reduce mutual coupling in an antenna array. A parametric study was made to determine the influence of mutual coupling depending on the distance between each element. A decoupling structure is proposed which consists on a grounded vertical copper plane between every patch. To achieve a better isolation, these new elements introduce an extra coupling. The experimental results indicate that using a Copper Vertical Plane Structure the Coupling can be reduced in 3dB.engMutual CouplingDecoupling structureconference object10.1109/IMWS-5G.2018.8484705